Tape remover machine
Tape remover machine
The tape peeling machine is a device that removes protective films adhered to wafers. Wafers supplied in cassettes are positioned using an aligner, and after tape peeling, they are discharged into the same cassette. ■ Thin Workpiece Compatibility ■ By adopting a unique peeling mechanism and a full-suction table, stress on the wafer is minimized, making it compatible with thin wafers. ■ Retry Function ■ After the peeling operation, a sensor checks for peeling confirmation. If it fails, the peeling operation is reinitiated to prevent any residue. (Number of retries can be set) ■ Alignment Function ■ Before peeling, alignment is performed on the alignment table to match the angle position of the orifice and notch, and to center the wafer, preventing peeling defects due to positional misalignment. ■ Tact Adjustment Function ■ Peeling speed, transport speed, and other parameters can be set via a touch panel, allowing adjustments to suit the workpiece. ■ Tape Empty Detection ■ The remaining amount of peeling tape is detected by a sensor. When the remaining amount reaches 5 meters (modifiable), an alarm notifies the user, eliminating unnecessary machine stops. ■ Static Electricity Countermeasures ■ Equipped with an ionizer (static electricity eliminator) as standard.
- Company：大宮工業 営業本部営業課
- Price：Other
